THERMAL-SHOCK PROPERTIES OF SIC WHISKER-REINFORCED SILICON-NITRIDE CERAMICS

被引:0
|
作者
SATO, Y
UEKI, M
机构
来源
SILICON NITRIDE 93 | 1994年 / 89-91卷
关键词
SILICON NITRIDE; SILICON CARBIDE WHISKER; COMPOSITE; THERMAL SHOCK RESISTANCE; THERMAL CONDUCTIVITY;
D O I
暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Improvement in the thermal shock durability of the hot-pressed silicon nitride with Y2O3 and Al2O3 as sintering aids by incorporation of silicon carbide whiskers was carefully investigated. Using a standard bending specimen in size of 3x4x40mm, the thermal shock durability was evaluated by water quenching method. As a measure of the thermal shock durability, the quenching temperature defference, Delta T, was larger than 1000 degrees C for the materials incorporated with silicon carbide whiskers. On the other hand, the silicon nitride ceramics without whiskers exhibited Delta T=600 degrees C. The improvement of the Delta T due to incorporation of whiskers was discussed on the factors affecting to the thermal shock durability such as strength, Young's modulus, Poisson's ratio, thermal expansion coefficient and thermal conductivity.
引用
收藏
页码:613 / 616
页数:4
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