MOLECULAR-DYNAMICS SIMULATION OF DISPLACEMENT CASCADES IN CU AND NI - THERMAL SPIKE BEHAVIOR

被引：177
|
作者：
DELARUBIA, TD
AVERBACK, RS
HSIEH, H
BENEDEK, R
机构：
[1] UNIV ILLINOIS,DEPT MAT SCI & ENGN,URBANA,IL 61801
[2] ARGONNE NATL LAB,DIV MAT SCI,ARGONNE,IL 60439
[3] SUNY ALBANY,DEPT PHYS,ALBANY,NY 12222
来源：
JOURNAL OF MATERIALS RESEARCH | 1989年 / 4卷 / 03期
关键词：
D O I：
10.1557/JMR.1989.0579
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：579 / 586
页数：8
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