A HOT COMPRESSION TESTING APPARATUS FOR THE STUDY OF ISOTHERMAL FORGING

被引:0
|
作者
IMMARIGEON, JPA [1 ]
KANDEIL, AY [1 ]
WALLACE, W [1 ]
DEMALHERBE, MC [1 ]
机构
[1] CARLETON UNIV,OTTAWA K1S 5B6,ONTARIO,CANADA
关键词
D O I
暂无
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:273 / 281
页数:9
相关论文
共 50 条
  • [1] CONTRIBUTION TO HOT ISOTHERMAL FORGING
    CHOUDHURY, A
    HENGSBERGER, E
    STAHL UND EISEN, 1989, 109 (22): : 1114 - 1120
  • [2] CHOOSING OPTIMAL FORGING CONDITIONS IN ISOTHERMAL AND HOT-DIE FORGING.
    Boer, C.R.
    Rydstad, H.
    Schroeder, G.
    Journal of applied metalworking, 1985, 3 (04): : 421 - 431
  • [3] CHOOSING OPTIMAL FORGING CONDITIONS IN ISOTHERMAL AND HOT-DIE FORGING.
    Boer, C.R.
    Rydstad, H.
    1600, (51):
  • [4] THE OCCURRENCE OF SHEAR BANDS IN ISOTHERMAL, HOT-FORGING
    SEMIATIN, SL
    LAHOTI, GD
    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1982, 13 (02): : 275 - 288
  • [5] HOT WORKING BEHAVIOR OF VINERTIA DURING ISOTHERMAL FORGING
    IMMARIGEON, JPA
    WALLACE, W
    JOURNAL OF METALS, 1979, 31 (08): : F54 - F54
  • [6] ISOTHERMAL AND HOT-DIE FORGING - BACKGROUND AND APPLICATIONS
    SEMIATIN, SL
    ALTAN, T
    JOURNAL OF METALS, 1983, 35 (12): : 88 - 88
  • [7] COMPUTER-SIMULATION OF ISOTHERMAL AND HOT DIE FORGING
    HOWSON, TE
    DELGADO, HE
    JOURNAL OF METALS, 1985, 37 (11): : A31 - A31
  • [8] AN ANALYSIS OF THE ISOTHERMAL HOT COMPRESSION TEST
    OH, SI
    SEMIATIN, SL
    JONAS, JJ
    METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1992, 23 (03): : 963 - 975
  • [9] Isothermal forging of AA2618+20% Al2O3 by means of hot torsion and hot compression tests
    Cavaliere, P
    Cerri, E
    Evangelista, E
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2004, 387 : 857 - 861
  • [10] Study on isothermal forging process for aviation joint forging
    Liao, Guo-Fang
    Yi, You-Ping
    Wang, Shao-Hui
    Cailiao Kexue yu Gongyi/Material Science and Technology, 2012, 20 (01): : 6 - 10