IMMERSION WAVE SOLDERING PROCESS

被引：6
|
作者：
GETTEN, JR
SENGER, RC
机构：
来源：
IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1982年 / 26卷 / 03期
关键词：
D O I：
10.1147/rd.263.0379
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：379 / 382
页数：4
相关论文
共 50 条
  • [1] Design of experiments (DOE) of automatic soldering process "wave soldering"
    Tsenev, V
    Marinov, L
    [J]. 27th International Spring Seminar on Electronics Technology, Books 1-3, Conference Proceedings: MEETING THE CHALLENGES OF ELECTRONICS TECHNOLOGY PROGRESS, 2004, : 338 - 341
  • [2] CHARACTERIZATION AND OPTIMIZATION OF A WAVE-SOLDERING PROCESS
    MESENBRINK, P
    LU, JC
    MCKENZIE, R
    TAHERI, J
    [J]. JOURNAL OF THE AMERICAN STATISTICAL ASSOCIATION, 1994, 89 (428) : 1209 - 1217
  • [3] Continuous improvement approaches for wave soldering process
    Chu, J
    Huang, T
    [J]. SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 459 - 467
  • [4] Development of lead-free wave soldering process
    Arra, M
    Shangguan, D
    Yi, S
    Thalhammer, R
    Fockenberger, H
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (04): : 289 - 299
  • [5] Optimising the wave soldering process for lead free solders
    Stoyanov, S
    Bailey, C
    Saxena, N
    Adams, S
    [J]. 2005 International Conference on Asian Green Electronics: Design for Manufacturability and Reliability, Proceedings, 2004, : 125 - 128
  • [6] Inerting the wave soldering process with membrane generated nitrogen
    Shea, C
    [J]. SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 452 - 458
  • [7] Numerical Modeling of the Wave Soldering Process and Experimental Validation
    Carvalho, Violeta
    Arcipreste, Bruno
    Soares, Delfim
    Ribas, Luis
    Rodrigues, Nelson
    Teixeira, Senhorinha F. C. F.
    Teixeira, Jose Carlos
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2022, 144 (01)
  • [8] Development and validation of lead-free wave soldering process
    Forstén, A
    Steen, H
    Wilding, I
    Friedrich, J
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2000, 12 (03) : 29 - 34
  • [9] Wave soldering bumping process incorporating electroless nickel UBM
    Lin, KL
    Chen, JW
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (01): : 143 - 150
  • [10] The effect of the hot air levelling process on skip solder defects in the wave soldering process
    Choon, TK
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2003, 15 (02) : 28 - 34
12345