AUTOMATED VISUAL INSPECTION OF SOLDER PASTE DEPOSITION ON SURFACE MOUNT TECHNOLOGY PCBS

被引：2
|
作者：
MAHON, J [1 ]
HARRIS, N [1 ]
VERNON, D [1 ]
机构：
[1] UNIV DUBLIN TRINITY COLL,DEPT COMP SCI,DUBLIN 2,IRELAND
来源：
COMPUTERS IN INDUSTRY | 1989年 / 12卷 / 01期
关键词：
D O I：
10.1016/0166-3615(89)90029-8
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
引用
收藏
页码：31 / 42
页数：12
相关论文
共 50 条
  • [1] SOLDER PASTE FOR SURFACE MOUNT TECHNOLOGY
    Anjard Sr., Ronald P.
    [J]. Brazing & soldering, 1985, (09): : 19 - 23
  • [2] Plastic solder paste stencil for surface mount technology
    Wong, CK
    Waldorf, DJ
    Rinzel, L
    [J]. TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS, 2000, : 294 - 304
  • [3] Automatic visual inspection of surface mount solder joint defects
    Oyeleye, O
    Lehtihet, EA
    [J]. INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 1999, 37 (06) : 1217 - 1242
  • [4] Mechanical reliability of solder joints in PCBs assembled in surface mount technology
    Borecki, Janusz
    Serzysko, Tomasz
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016, 28 (01) : 18 - 26
  • [5] Hidden Solder Joints Inspection used in Surface-mount Technology
    Stoynova, Anna
    Georgiev, Nikolay
    Erinin, Anton
    Bonev, Borislav
    [J]. 2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2016, : 154 - 159
  • [6] Orthogonal fuzzy model of the solder paste printing stage of surface mount technology
    Lotfi, A
    Howarth, M
    Thomas, PD
    [J]. PROCEEDINGS OF THE SIXTH IEEE INTERNATIONAL CONFERENCE ON FUZZY SYSTEMS, VOLS I - III, 1997, : 1433 - 1437
  • [7] Automated Optical Inspection of Solder Paste based on 2.5D Visual Images
    Pang, Grantham K. H.
    Chu, Ming-Hei
    [J]. 2009 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION, VOLS 1-7, CONFERENCE PROCEEDINGS, 2009, : 982 - 987
  • [8] AUTOMATED VISUAL INSPECTION OF SOLDER BUMPS
    RAY, R
    [J]. AT&T TECHNICAL JOURNAL, 1988, 67 (02): : 47 - 60
  • [9] Automated Inspection of Solder Paste by Directional LED Lighting
    Pang, Grantham K. H.
    Chu, Ming-Hei
    [J]. 2008 IEEE INTERNATIONAL CONFERENCE ON AUTOMATION AND LOGISTICS, VOLS 1-6, 2008, : 232 - 237
  • [10] Inspection of solder paste deposition for chip scale assembly
    General Scanning Inc, Ann Arbor, United States
    [J]. Natl Electron Packag Prod Conf Proc Tech Program, (981-983):
12345