C2L - NEW HIGH-SPEED HIGH-DENSITY BULK CMOS TECHNOLOGY

被引：13
|
作者：
DINGWALL, AGF [1 ]
STRICKER, RE [1 ]
机构：
[1] RCA CORP,CTR SOLID STATE TECHNOL,SOMERVILLE,NJ 08876
来源：
IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1977年 / 12卷 / 04期
关键词：
D O I：
10.1109/JSSC.1977.1050912
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：344 / 349
页数：6
相关论文
共 50 条
  • [1] HIGH-SPEED BULK CMOS C2L MICROPROCESSOR
    DINGWALL, AGF
    STRICKER, RE
    SINNIGER, JO
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1977, 12 (05) : 457 - 462
  • [2] DESIGN OF HIGH-SPEED, HIGH-DENSITY CNNS IN CMOS TECHNOLOGY
    CRUZ, JM
    CHUA, LO
    INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 1992, 20 (05) : 555 - 572
  • [3] GATED ISOLATION STRUCTURE FOR HIGH-DENSITY, HIGH-SPEED RADIATION-HARDENED BULK CMOS TECHNOLOGY
    CHEN, HH
    HSU, JJ
    LIANG, WC
    WANG, HY
    HUANG, FJ
    CHOU, TG
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (03) : C129 - C129
  • [4] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS
    ZEHNER, B
    KLOSE, H
    FEIGE, D
    WIEDER, A
    SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1988, 17 (06): : 278 - 283
  • [5] BICMOS, a technology for high-speed/high-density ICs
    Zehner, Bernd
    Klose, Helmut
    Wieder, Armin
    Feige, Dieter
    Siemens Forschungs- und Entwicklungsberichte/Siemens Research and Development Reports, 1988, 17 (06): : 278 - 283
  • [6] BICMOS, A TECHNOLOGY FOR HIGH-SPEED HIGH-DENSITY ICS
    KLOSE, H
    ZEHNER, B
    WIEDER, A
    PROCEEDINGS - IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN : VLSI IN COMPUTERS & PROCESSORS, 1989, : 304 - 309
  • [7] A high-density, matched hexagonal transistor structure in standard CMOS technology for high-speed applications
    Van den Bosch, A
    Steyaert, MSJ
    Sansen, W
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2000, 13 (02) : 167 - 172
  • [8] A NEW CR-DELAY CIRCUIT TECHNOLOGY FOR HIGH-DENSITY AND HIGH-SPEED DRAMS
    WATANABE, Y
    OHSAWA, T
    SAKURAI, K
    FURUYAMA, T
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1989, 24 (04) : 905 - 910
  • [9] High-speed transmitters in 90nm CMOS for high-density optical interconnects
    Palermo, Samuel
    Horowitz, Mark
    ESSCIRC 2006: PROCEEDINGS OF THE 32ND EUROPEAN SOLID-STATE CIRCUITS CONFERENCE, 2006, : 508 - +
  • [10] New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design
    Eo, Y
    Eisenstadt, WR
    Jeong, JY
    Kwon, OK
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 303 - 312
12345