共 50 条
- [2] Thermal behaviour of silver-filled epoxy adhesives. Technological implications in microelectronics [J]. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2001, 66 (01): : 223 - 232
- [3] Thermal Behaviour of Silver-Filled Epoxy Adhesives. Technological implications in microelectronics [J]. Journal of Thermal Analysis and Calorimetry, 2001, 66 : 223 - 232
- [4] Attenuation in silver-filled conductive epoxy interconnects [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (01): : 52 - 59
- [5] ELECTRICAL-CONDUCTION IN SILVER THIOCYNATE [J]. JOURNAL OF CHEMICAL PHYSICS, 1980, 72 (05): : 3435 - 3435
- [6] ALUMINUM BOND PAD CONTAMINATION BY THERMAL OUTGASSING OF ORGANIC MATERIAL FROM SILVER-FILLED EPOXY ADHESIVES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (04): : 586 - 592
- [8] Conductive Adhesives at Microwave Frequencies: Silver-Filled vs. Graphite-Filled [J]. 2023 17TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION, EUCAP, 2023,
- [10] Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization [J]. Journal of Electronic Materials, 2005, 34 : 1432 - 1439