MUTUAL COUPLING BETWEEN MICROSTRIP DIPOLES IN MULTIELEMENT ARRAYS

被引:14
|
作者
KATEHI, PB
机构
关键词
D O I
10.1109/8.18722
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:275 / 280
页数:6
相关论文
共 50 条
  • [1] MUTUAL COUPLING WITH DIPOLES IN ARRAYS
    TOULIS, WJ
    JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 1963, 35 (07): : 1062 - &
  • [2] Mutual coupling in finite microstrip patch arrays
    Xi, YP
    Fang, DG
    Sun, YX
    Chow, YL
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2005, 44 (06) : 577 - 581
  • [3] On the mutual coupling of the finite microstrip antenna arrays
    Wang, H.
    Fang, D. G.
    Xi, Y. P.
    Luan, C. Z.
    Wang, B.
    2007 4TH INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY PROCEEDING: EMC 2007, 2007, : 10 - 14
  • [4] Mutual coupling in conformal microstrip patch antenna arrays
    Sangster, AJ
    Jacobs, RT
    IEE PROCEEDINGS-MICROWAVES ANTENNAS AND PROPAGATION, 2003, 150 (04) : 191 - 196
  • [5] SERIES EXPANSIONS FOR THE MUTUAL COUPLING IN MICROSTRIP PATCH ARRAYS
    JACKSON, DR
    RICHARDS, WF
    ALIKHAN, A
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 1989, 37 (03) : 269 - 274
  • [6] An interactive package for microstrip antenna arrays with mutual coupling
    Kishk, AA
    IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM 1997, VOLS 1-4, 1997, : 2494 - 2497
  • [7] MUTUAL COUPLING BETWEEN MICROSTRIP ANTENNAS
    PENARD, E
    DANIEL, JP
    ELECTRONICS LETTERS, 1982, 18 (14) : 605 - 607
  • [8] Minimising mutual coupling in thick substrate microstrip antenna arrays
    Bamford, LD
    James, JR
    Fray, AF
    ELECTRONICS LETTERS, 1997, 33 (08) : 648 - 650
  • [9] TLM analysis of the mutual coupling of microstrip patch antenna arrays
    Yang, S
    Gosling, IG
    Tan, SH
    Sorwar, MG
    IEE PROCEEDINGS-MICROWAVES ANTENNAS AND PROPAGATION, 2000, 147 (03) : 207 - 210
  • [10] Analytical solution for mutual coupling in microstrip patch antenna arrays
    Dawoud, Mahmoud M.
    Amjad, Meerja K.
    ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING, 2006, 31 (1B) : 47 - 60