ASSESSMENT OF DURABILITY UNDER CONDITIONS OF THERMAL CYCLING ON THE BASIS OF THE RESULTS OBTAINED IN CREEP

被引：0
|
作者：
ZUCHOWSKI, R
BUBA, N
机构：
来源：
RES MECHANICA | 1982年 / 5卷 / 04期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：317 / 322
页数：6
相关论文
共 50 条
  • [1] ASSESSMENT OF DURABILITY UNDER CONDITIONS OF THERMAL CYCLING ON THE BASIS OF THE RESULTS OBTAINED IN CREEP.
    Zuchowski, R.
    Buba, N.
    Res Mechanica: International Journal of Structural Mechanics and Materials Science, 1982, 5 (04): : 317 - 322
  • [2] Durability Assessment of Photovoltaic (PV) Products Under Environmental Thermal Cycling
    Akman, J.
    Choi, C.
    Mukherjee, S.
    Meng, J.
    Mirbagheri, E.
    Haddad, G.
    Das, D.
    Dasgupta, A.
    Gaston, R.
    Kauffmann, K.
    Feng, J.
    Liu, H.
    Ramesh, N.
    2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 1264 - 1270
  • [3] Durability of marine concrete under thermal cycling loads
    Delft Univ of Technology, Delft, Netherlands
    Heron, 1 (15-28):
  • [4] The sintering and creep and cracking of thermal barrier coatings under thermal cycling
    Cen, L.
    Qin, W. Y.
    Yu, Q. M.
    ENGINEERING FAILURE ANALYSIS, 2022, 133
  • [5] Durability Study of SOFCs Under Cycling Current Load Conditions
    Hagen, A.
    Hendriksen, P. V.
    Frandsen, H. L.
    Thyden, K.
    Barfod, R.
    FUEL CELLS, 2009, 9 (06) : 814 - 822
  • [6] SOFTENING MECHANISM OF CREEP RESISTANT ALLOYS UNDER THERMAL CYCLING
    PROSVIRI.VI
    GORYUNOV, SA
    MORTIKOV, VD
    TYASINA, AN
    PHYSICS OF METALS AND METALLOGRAPHY-USSR, 1969, 27 (05): : 154 - &
  • [7] METHODS FOR DURABILITY TESTS UNDER MUTUAL ACTIVITY CONDITIONS OF FATIGUE AND CREEP
    OLKIN, SI
    ZAVODSKAYA LABORATORIYA, 1975, 41 (10): : 1254 - 1256
  • [8] Thermal Cycling Durability Assessment and Enhancement of FBGA Package for Automotive Applications
    Ma, Yiyi
    Talledo, Jefferson
    Luan, Jing-en
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
  • [9] Numerical simulation of creep strain of PBGA solders under thermal cycling
    Sun, F. L.
    Liu, Y.
    Wang, L. F.
    EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 411 - +
  • [10] DEVICE FOR TESTING METALS UNDER CONDITIONS OF THERMAL CYCLING
    MASLOV, AA
    INDUSTRIAL LABORATORY, 1978, 44 (05): : 719 - 720
12345