DEPOSITION BY EVAPORATION OF CU-AL ALLOY-FILMS

被引：15
|
作者：
DHEURLE, F [1 ]
ALLIOTA, C [1 ]
ANGILELLO, J [1 ]
BRUSIC, V [1 ]
DEMPSEY, J [1 ]
IRMISCHER, D [1 ]
机构：
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
来源：
VACUUM | 1977年 / 27卷 / 04期
关键词：
D O I：
10.1016/0042-207X(77)90017-3
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：321 / 327
页数：7
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