HOT-DIP TIN PLATING OF COPPER WIRES .2. SOLUTION OF COPPER WIRE IN TIN BATH - WETTING OF COPPER WIRE WITH TIN AND HEAT BALANCE OF WETTING

被引：0
|
作者：
FIDOS, H
SCHREINE.H
机构：
来源：
ZEITSCHRIFT FUR METALLKUNDE | 1970年 / 61卷 / 04期
关键词：
D O I：
暂无
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：273 / &
相关论文
共 44 条
  • [1] HOT-DIP TIN PLATING OF COPPER WIRES .1. PROPERTIES OF EPSILON AND ETA' PHASES AND DIFFUSION OF SOLID COPPER IN LIQUID TIN - CALCULATION OF DIFFUSION CONSTANTS AND ACTIVATION ENERGY
    FIDOS, H
    SCHREINE.H
    ZEITSCHRIFT FUR METALLKUNDE, 1970, 61 (03): : 225 - &
  • [2] SINGLE-STRAND TIN PLATING LINE FOR COPPER WIRE
    不详
    WIRE, 1978, 27 (02): : 74 - 75
  • [3] COATING OF COPPER WIRE WITH LEAD, TIN AND LEAD-TIN.
    Benninghoff, Hanns
    Wireworld international, 1979, 21 Double (05): : 178 - 179
  • [4] Study on microstructure control of copper-tin biphase interface in hot-dip tin-plated electronic copper strip
    Ouyang, Yulu
    Liu, Yahui
    Zhu, Qianqian
    Zhang, Guoshang
    Song, Kexing
    Huang, Tao
    Lu, Weiwei
    Liu, Dong
    Liu, Aikui
    Wang, Binbin
    Li, Qi
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2024, 33 : 7169 - 7181
  • [5] The Effect of Testing a Copper Wire and a Copper Wire Coated with SnPb Solder using a Wetting Balance Machine
    Woods, Bobby
    Gillick, Christy
    WORLD CONGRESS ON ENGINEERING, WCE 2010, VOL III, 2010, : 2327 - 2330
  • [6] COATING OF COPPER WIRE BY ELECTROLYTICALLY DEPOSITED TIN.
    Whitehouse, John
    Wire Industry, 1985, 52 (615): : 170 - 171
  • [7] On the wetting of aluminum and copper surface by tin-lead melts
    Kambolov D.A.
    Kashezhev A.Z.
    Kutuev R.A.
    Korotkov P.K.
    Manukyants A.R.
    Ponezhev M.K.
    Sozaev V.A.
    Journal of Surface Investigation, 2015, 9 (03): : 636 - 640
  • [8] WETTING AND BONDING OF DIAMONDS BY COPPER-TIN-TITANIUM ALLOYS
    EVENS, D
    NICHOLAS, M
    SCOTT, PM
    INDUSTRIAL DIAMOND REVIEW, 1977, (SEP): : 306 - 309
  • [9] TINNING OF COPPER WIRE - A COMPARISON OF HOT-DIP AND ELECTROLYTIC TINNING
    WEBER, E
    WIRE, 1967, (90): : 177 - &
  • [10] Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
    Sun, Xuemin
    Yu, Weiyuan
    Wang, Fengfeng
    Wang, Yanhong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (01) : 1073 - 1079
12345